Primarily development and validation of unified material models incorporating thermomechanical and degradation behavior, especially with a view towards enhancing the reliability of electronic systems; and by extension, issues related to computer modeling for complex systems as well as the broader impact of information technology which in turn can affect education and research.

• Ph.D. in Engineering Mechanics, with a minor in Electrical and Computer Engineering, University of Arizona, Tucson (CGPA: 4.00)
• Ph.D. Qualifiers and Coursework, CALCE, University of Maryland (CGPA: 3.82)
• Dissertation: Constitutive Modeling of Joining Materials in Electronic Packaging.
• Masters in Mechanical Engineering, specializing in Engineering Design, State University of New York, Binghamton (CGPA: 3.875)
• Thesis: Paste Deposition Quality in Solder Paste Printing.
• Bachelor of Technology in Mechanical Engineering, Indian Institute of Technology, Bombay
• Thesis: Study of techniques for transient dynamic response analysis of systems
• Design Project: Heat exchanger design for wastewater heat recovery
• Std XII: Gold medal in National Standard Exam in Physics
• Std X: National merit list (top 1%) overall, in Science and in English; overall All India rank 113.

• Is IT Green: Making IT Greener, Site Manager at Yeditepe, EU-LLP Project
• Wellbore Stability Analysis, Consultant/Sub-contractor via UA, ExxonMobil
• Solder modeling and testing, Research Assistant via UA, NSF/Boeing
• Condition-based monitoring of electronic systems, Research Assistant via UMD, UKMoD
• Failure Analysis of Liquid Crystal Displays, Research Assistant via UMD, Smith Aerospace
• Qualification of on-board commercial LCD display unit, Research Assistant via UMD, Military
• FE analysis of traffic-signaling system for OSHA certification for Galleaux Inc., Research Assistant via SPIR-SUNY
• FE Analysis of baseframe for bearing assembly system for Timken, Design Engineer, J.H.Robotics/ Research Assistant, SPIR-SUNY

• Aydin, S., and Dube, M., "Knowledge Management, Innovation and Competitive Advantage: Is the Relationship in the Eye of the Beholder?", Knowledge Management Research & Practice, 16(3), July 2018, pp 402-413.
• Dube, S., and Dube, M., Basics First: Let money buy happiness and a central store that provides for all, Iff Books, September 2017.
• Dube, S., Dube, M. & Turan, A. "Information technology in Turkey: Creating high-skill jobs along with more unemployed highly-educated workers?" Telecommunications Policy 39(10), November 2015, pp 811-829.
• Dube, S., and Dube, M., (forthcoming) "Importance of Interdepartmental Control and Potential Pitfalls", Case Study for Chapter 20, Performance Management of Contemporary Management: A Global Perspective, Charles Wankel, Ed., Palgrave Macmillan.
• Dube, M., and Dube, S., "Criticality of Robustness Checks for Complex Simulations and Modeling", Information - An International Interdisciplinary Journal, v. 16 no. 11, November 2013, pp 7917 - 7940.
• Dube, M., and Kundu, T., "Closure to "Discussion of 'Yield Function for Solder Elastoviscoplastic Modeling'"" (5 pages), ASME Journal of Electronic Packaging, v133 no. 4, December, 2011.
• Dube, S., and Dube, M., Case Study: "If You Can't Beat Them, Join Them?" 2010, Ivey Publishing/ Harvard Business Review.
• Dube, S., and Dube, M., Teaching Note for Case Study "If You Can't Beat Them, Join Them?" 2010, Ivey Publishing/ Harvard Business Review.
• Dube, M., and Kundu, T., "Yield Function for Elastoviscoplastic Solder Modeling", ASME Journal of Electronic Packaging, v. 127 no. 2, June 2005, pp. 147- 156.
• Desai, C., Wang, Z., and Dube, M., "New Thermomechanical Device and Testing Towards Modeling of Joining Materials", Proceedings of IPAC'01, Kauai, Hawaii, July 8 - 13, 2001.
• Pecht, M., Dube, M., Natishan. M., (CALCE) and Williams, R. Banner, I. Knowles (UK-MoD), "Evaluation of Built-in Test", IEEE Trans. Aerospace and Electronics Systems, vol. 37, no 1, Jan. 2001, pp. 266 - 271.
• Dishongh, T.J., Dube, M., Pecht. M., and Wyler, J., "Failure Analysis of Liquid Crystal Displays Due to Indium Tin Oxide Breakdown" , ASME, Vol. 121, June 1999
• Williams, R., Banner, J., Knowles, I., (UK-MoD) and Dube, M., Natishan, M., Pecht, M., (CALCE) "An Investigation of 'Cannot Duplicate' Failures", Qual. Reliab. Engng. Intl, no. 14, 1998, pp. 331 - 337.
• Dube, M., Dishongh, T.J., Beatty, K., and Pecht, M., " Rapid In-Situ Temperature Measurements of PQFPs During Infrared Reflow", Circuit World, 1998
• Dube, M., "Implications of Cannot Duplicate", MFPT Conference, Virginia Beach, VA, March 30 - April 13, 1998
• Natishan, M., and Dube, M., "Health Monitoring of Electronics Systems", Proc. Predictive Technology Symp, Alexandria, VA, Nov 6-7, 1997
• Dube, M., and Sahay, C., "Uniform Entry Flow for Low Reynolds Numbers", ASME Winter Annual Conference and Exposition, Atlanta GA, Nov. 17 - 22, 1996